Quantum
EV Group Helps Accelerate Qubit Scaling for Quantum Computing Through Advanced Packaging Expertise
Publication: The Quantum Insider
Author: Mohib Ur Rehman
Source published: 09/11/2026, 14:52:08 UTC
Briefing created: 10/11/2026, 06:05:00 UTC
Based on a feed excerpt; full article content has not been acquired. Source evidence retrieved 09/11/2026, 15:49:25 UTC.
Briefings
EV Group announced it will support quantum chip developers by applying advanced packaging expertise to address manufacturing challenges as qubit scaling progresses. The company highlighted its process technologies, including fusion and hybrid bonding, oxide-free bonding, and thin-wafer processing, at SEMICON Europa in Munich, Germany, from November 10-13, 2026. Key partners include Xanadu and Silicon Austria Labs, with the CHAMP-ION pilot line project for industrial-scale ion-trap quantum chips. McKinsey & Company cited quantum computing's potential to generate $2.7 trillion in economic value by 2035, emphasizing the need for fault-tolerant systems with increased physical qubits. Dr. Bernd Dielacher, director of business development at EVG, noted that scaling requires integrating complex architectures without compromising performance. The briefing covers the announcement and strategic partnerships but does not specify current qubit counts or error correction thresholds.
Key points
- EV Group (EVG) announced it will support quantum chip developers by applying advanced packaging expertise to address manufacturing challenges as qubit scaling progresses.
- EVG collaborated with Xanadu and Silicon Austria Labs on the CHAMP-ION pilot line project for industrial-scale production of ion-trap quantum chips.
Context
Quantum computing could create up to $2.7 trillion of economic value worldwide by 2035 according to McKinsey & Company. Scaling the number of qubits while maintaining performance requires significantly increasing the number of physical qubits for error correction. Different quantum computing architectures rely on a wide range of materials and device structures, creating demanding requirements for high-density interconnections and heterogeneous materials integration.
Limitations
The briefing covers the announcement and strategic partnerships but does not specify current qubit counts, error correction thresholds, or specific performance metrics. It does not provide data on manufacturing challenges beyond scaling qubit numbers, nor does it include specific dates for pilot line operations or detailed error correction protocols.
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